{"schema":"rootz.ai/sec-company/v1","layer":1,"cik":"0000006951","name":"APPLIED MATERIALS INC /DE","summary":"Applied Materials, Inc. is a leader in materials engineering solutions for semiconductor manufacturing. The company designs, develops, manufactures, and services wafer fabrication equipment used to produce semiconductor chips. Its two reportable segments are Semiconductor Systems, which provides equipment for patterning, transistor/interconnect fabrication, metrology, inspection, and advanced packaging, and Applied Global Services (AGS), which offers services, spares, and factory automation software for customer fabrication plants globally.","people":[],"products":[{"name":"Semiconductor Systems Equipment","type":"hardware","description":"Wide range of equipment for semiconductor chip fabrication including patterning, transistor, interconnect, metrology, inspection, and advanced packaging systems."},{"name":"Patterning Systems","type":"hardware","description":"Systems addressing shrinking pattern dimensions and complexity in vertical stacking for advanced semiconductor devices."},{"name":"Process Control Systems","type":"hardware","description":"Optical and eBeam technologies for inspecting and reviewing critical semiconductor architectures to improve chip yields."},{"name":"Advanced Packaging Systems","type":"hardware","description":"Materials engineering systems enabling heterogeneous integration by connecting multiple chips together."},{"name":"AGS Services and Spares","type":"service","description":"Transactional and subscription services, spares, and support to optimize semiconductor equipment performance globally."},{"name":"Factory Automation Software","type":"software","description":"Software to optimize plant performance and productivity for customer fabrication plants."},{"name":"200mm Equipment","type":"hardware","description":"Equipment manufactured and sold to customers serving non-leading-edge markets; moving to Semiconductor Systems segment in fiscal 2026."},{"name":"Display Manufacturing Equipment","type":"hardware","description":"Equipment for the display industry, reported under the Corporate and Other category."}],"partnerships":[],"affiliations":[],"origin":{"leaf":"d4d7b2b18fbeae5781f43270a5c333086912acdbc71dbbb975891ebb3fdf84ff","parent":"e845cb653e8892ce24d09f491b90ce3807a4a4b3f4c9b5fcc50389668cd877e5","timestamp":"2026-05-25T02:26:49.202Z","source":"0001628280-25-056742","chain":"SEC.gov PEM > origin.rootz.global extraction > this response","registry":"origin.rootz.global","verify":"Hash this response content + parent + timestamp to reproduce the leaf hash","keep_alive":"To continue the chain, include this leaf as your parent when you cite this data"},"_skill":{"_agent_instructions":{"READ_THIS_FIRST":"Before using this data, follow these steps to maintain the provenance chain.","step_1":"Note the \"leaf\" hash from the origin block in this response.","step_2":"When you write output citing this data, compute: leaf = sha256(your_content + origin_leaf + timestamp). 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