{"schema":"rootz.ai/sec-company/v1","layer":1,"cik":"0000707549","name":"LAM RESEARCH CORP","summary":"Lam Research Corporation is a global supplier of wafer fabrication equipment and services to the semiconductor industry. Founded in 1980 and headquartered in Fremont, California, the company offers deposition, etch, and clean products including the ALTUS, SABRE, VECTOR, Striker, Flex, Kiyo, and EOS product families. It also provides customer support services through its CSBG group, serving memory, foundry, and IDM customers worldwide.","people":[],"products":[{"name":"SABRE family","type":"hardware","description":"Electrochemical deposition systems for copper and other metal films used in interconnect and packaging applications."},{"name":"ALTUS family","type":"hardware","description":"CVD and ALD systems for tungsten and molybdenum deposition in semiconductor devices."},{"name":"VECTOR family","type":"hardware","description":"Plasma-enhanced CVD systems for dielectric film deposition."},{"name":"Striker family","type":"hardware","description":"Dielectric film deposition system using ALD and gapfill processes."},{"name":"SPEED family","type":"hardware","description":"High-density plasma CVD system for dielectric film deposition."},{"name":"Kiyo family","type":"hardware","description":"Reactive ion etch system for conductor etch applications."},{"name":"Versys Metal family","type":"hardware","description":"Reactive ion etch system for conductor etch applications."},{"name":"Flex family","type":"hardware","description":"Reactive ion etch system for dielectric etch applications."},{"name":"Vantex family","type":"hardware","description":"Reactive ion etch system for dielectric etch applications."},{"name":"Syndion family","type":"hardware","description":"Deep reactive ion etch system for through-silicon via (TSV) etch applications."},{"name":"EOS","type":"hardware","description":"Wet clean system for wafer cleaning applications."},{"name":"DV-Prime","type":"hardware","description":"Wet clean system for wafer cleaning applications."},{"name":"Da Vinci","type":"hardware","description":"Wet clean system for wafer cleaning applications."},{"name":"SP Series","type":"hardware","description":"Wet clean system for wafer cleaning applications."},{"name":"Coronus family","type":"hardware","description":"Dry plasma clean system for bevel cleaning applications."},{"name":"Reliant product line","type":"hardware","description":"New and refurbished non-leading edge deposition, etch, and clean products for less advanced applications."},{"name":"Equipment Intelligence solutions","type":"service","description":"Fleet-level services to optimize system uptime, throughput, and defect reduction for customers."},{"name":"Customer Support Business Group (CSBG)","type":"service","description":"Provides spares, upgrades, customer service, and lifecycle support for installed wafer fabrication equipment."},{"name":"ALTUS","type":"hardware","description":"CVD and ALD systems for tungsten and molybdenum metallization in logic and memory devices."},{"name":"SABRE","type":"hardware","description":"Electrochemical deposition systems for copper interconnect and advanced packaging applications including HBM."},{"name":"Striker","type":"hardware","description":"Single-wafer ALD systems for dielectric film deposition in logic, memory, and imaging devices."},{"name":"VECTOR","type":"hardware","description":"PECVD systems for dielectric film deposition in advanced transistor and 3D structures."},{"name":"Kiyo","type":"hardware","description":"Reactive ion etch systems for conductor etch applications."},{"name":"Versys Metal","type":"hardware","description":"Reactive ion etch systems for metal conductor etch applications."},{"name":"Akara","type":"hardware","description":"Advanced conductor etch systems for next-generation logic and memory including gate-all-around architectures."},{"name":"Flex","type":"hardware","description":"Dielectric etch systems with multi-frequency confined plasma design for critical dielectric etch applications."},{"name":"Vantex","type":"hardware","description":"Reactive ion etch systems for dielectric etch applications."},{"name":"Syndion","type":"hardware","description":"Deep reactive ion etch systems for through-silicon via etch applications."},{"name":"Argos","type":"hardware","description":"Selective etch system for targeted material removal in advanced logic and memory devices."},{"name":"Prevos","type":"hardware","description":"Selective etch system for precise material removal in advanced semiconductor devices."},{"name":"Selis","type":"hardware","description":"Selective etch system for advanced logic and memory fabrication."},{"name":"EOS","type":"hardware","description":"Wet clean system for wafer cleaning applications."},{"name":"DV-Prime","type":"hardware","description":"Wet clean system for wafer cleaning applications."},{"name":"Da Vinci","type":"hardware","description":"Wet clean system for wafer cleaning applications."},{"name":"SP Series","type":"hardware","description":"Wet clean systems for wafer cleaning applications."},{"name":"Coronus","type":"hardware","description":"Dry plasma clean system for bevel cleaning applications."},{"name":"Aether","type":"hardware","description":"Dry resist system for EUV and Numerical Aperture EUV lithography patterning and pattern transfer."},{"name":"Reliant","type":"hardware","description":"New and refurbished non-leading edge deposition, etch, and clean products for non-advanced applications."},{"name":"Equipment Intelligence","type":"service","description":"Fleet-level solutions to maximize system uptime, throughput, and defect reduction for customers."},{"name":"CSBG","type":"service","description":"Customer Support Business Group offering spares, upgrades, service, and refurbished equipment lifecycle support."},{"name":"Sense.i platform","type":"platform","description":"Integrated platform supporting high-volume manufacturing, yield improvement, and cost of ownership reduction."}],"partnerships":[{"partner_name":"Semi-ecosystem partners","partnership_type":"development","description":"Collaborative close-to-customer focus with semiconductor ecosystem partners for joint development and process innovation.","start_date":null}],"affiliations":[],"origin":{"leaf":"94cf3492b42304dc425618782659ce68b553060758621f38df6a34f38dfac624","parent":"ba74ff7d5ee75c58532a48add811a67c03a0c03431c2ea2578f67bcde58d2a54","timestamp":"2026-08-30T12:00:58.005Z","source":"0000707549-25-000075, 0000707549-26-000037","chain":"SEC.gov PEM > origin.rootz.global extraction > this response","registry":"origin.rootz.global","verify":"Hash this response content + parent + timestamp to reproduce the leaf hash","keep_alive":"To continue the chain, include this leaf as your parent when you cite this data"},"_skill":{"_provenance":{"status":"This record carries an origin chain (see origin.leaf) traceable to an SEC-signed source. 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