{"schema":"rootz.ai/sec-company/v1","layer":1,"cik":"0002058873","name":"Qnity Electronics, Inc.","summary":"Qnity Electronics, Inc. is a global leader in materials and solutions for the semiconductor and electronics industries, spun off from DuPont in November 2025. The company operates two segments: Semiconductor Technologies (CMP pads, CMP slurries, photoresists, cleaning chemistries, Kalrez sealants, OLED materials) and Interconnect Solutions (advanced packaging, thermal management, EMI shielding, flexible electronics). Key brands include IC1000, Ikonic, Kalrez, Kapton, Pyralux, Laird, and Riston. Over 90% of 2025 revenue came from consumable or unit-driven products.","people":[],"products":[{"name":"CMP Pads (IC1000, Ikonic, Visionpad, Optivision, Politex, Suba, Emblem)","type":"hardware","description":"Polishing pads used as consumables in chemical mechanical planarization during semiconductor manufacturing."},{"name":"CMP Slurries (Acuplane, Optiplane, Novaplane)","type":"hardware","description":"Slurry formulations enabling precise wafer surface polishing and planarization in semiconductor manufacturing."},{"name":"Advanced Cleans (PlasmaSolv, CuSolve, PCMPSolv, EtchSolv)","type":"hardware","description":"Specialty cleaning chemistries for photoresist removal, post-CMP cleaning, selective etching, and post-etch residue removal."},{"name":"Lithographic Materials (EPIC, EON, AR, MICROPOSIT, MEGAPOSIT, UVN, CTO, SPR)","type":"hardware","description":"Photoresists and anti-reflective coatings supporting UV, DUV, and EUV lithography for semiconductor patterning."},{"name":"Kalrez Perfluoroelastomer Parts","type":"hardware","description":"Specialized sealants engineered for high-heat and chemical-exposure environments including semiconductor manufacturing."},{"name":"Advanced Display Materials (OLED)","type":"hardware","description":"Innovative OLED materials offering higher efficiency, reduced voltage, and improved longevity for next-generation displays."},{"name":"Advanced Circuit & Packaging (Circuposit, Ecoposit, Microfab, Microfill, Nikal, Riston, Skyton, Silveron, Solderon, Intervia)","type":"hardware","description":"Metallization, photoresist, dielectric, and optical materials for advanced packaging, IC substrates, and PCBs."},{"name":"Laird Technologies (Tputty, Tflex, CoolZorb)","type":"hardware","description":"Thermal interface materials and EMI shielding solutions including gap fillers, phase change materials, and absorbers."},{"name":"Advanced Flex Technologies (Kapton, Oasis, Pyralux, Interra)","type":"hardware","description":"Polyimide films and flexible copper-clad laminate materials for demanding flexible electronic and insulation applications."}],"partnerships":[{"partner_name":"DuPont de Nemours, Inc.","partnership_type":"strategic","description":"Former parent company; completed separation of Qnity as an independent publicly traded company on November 1, 2025.","start_date":null},{"partner_name":"OEMs (unspecified)","partnership_type":"OEM","description":"OEM partners specify Qnity products into their manufacturing processes across the electronics value chain.","start_date":null},{"partner_name":"Semiconductor device manufacturers, foundries, and equipment providers (unspecified)","partnership_type":"development","description":"Collaboration on material development aligned with future semiconductor technology roadmaps.","start_date":null}],"affiliations":[],"origin":{"leaf":"955b6a7865f4c319c2b2542ed53618273b1436e2270450920447fc1340223c12","formula":"v2: sha256( sha256(content) || parent || source_accession )","content_sha256":"e940f9694d3d7a26f7e37453e436b6c5bfb998981e3e775310b419b36cd8259d","parent":"b32465867bf02aa23cbc88cd4497efe1600c7e2a87d1343535a2bbc6ff910665","source":"0002058873-26-000010","chain":"sec.gov/EDGAR (retrieved over TLS, accession recorded) > origin.rootz.global extraction > this response","registry":"origin.rootz.global","verify":"Recompute it: sha256(sha256(<this response body minus the origin block>) || parent || source_accession). 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